Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions Publisher: Artech House Publishers Author(s): Rick Sturdivant Number of pages: 280 Publication date: 2013 Dimensions: 235 x 159 x 22 Cover type: Hardback.
| Publisher | Artech |
|---|---|
| Author(s) | Rick |
| Number of pages | 280 |
| Publication date | 2013 |
| Dimensions | 235 x 159 x 22 |
| Cover type | Hardback |
918.99 Lei
